PRODUCTS LINE UP
High-power EMLSemiconductor Laser Diodes (LD)
Chip on carrier of EA-DFB laser monolithically integrated with SOA is useful for various optical sub-assembly (OSA).
FEATURES
- 10GBaud, 25GBaud* and 50GBaud* (*planning)
- Support NRZ and PAM4 format
- High optical output power and low power consumption
- Applicable to long-reach Ethernet/high-splitting-ratio PON
- Easy replacement from conventional EA-DFB laser
FUNCTION AND APPLICATIONS
- OLT for NG-PON2, 10G-EPON, XGS-PON, 25G-PON and 50G-PON
- Optical transceiver for 25G/50G/100G/200G/400G-based Ethernet
25Gbaud-based APD Chip on Carrier (CoC)Avalanche Photodiode (APD)
25Gbuad-based APD chip is mounted on a carrier as face down, which is useful as a component of optical sub-assembly (OSA).
FEATURES
- InP-based APD
- 25.78Gbps and 27.95Gbps
- High responsivity and gain, High resistivity for Overload
- Applicable for both of NRZ and PAM4 operation
FUNCTION AND APPLICATIONS
- Optical receivers for 25G/50G/100G/200G-based Ethernet and Access NW
10G/1Gbps Burst mode Transimpedance Amplifier (TIA)Burst Mode Transimpedance Amplifier (TIA)
10G/1Gbps dual rates Burst-mode TIA for the IEEE standard, 10G-EPON
FEATURES
- High input sensitivity and Low Noise
- High-speed AGC response
APPLICATIONS
- IEEE standard, 10G-EPON
10G/2.5G/1Gbps Burst mode Transimpedance Amplifier (TIA)Burst Mode Transimpedance Amplifier (TIA)
10G/2.5G/1G multi-rate Burst-mode TIA complied to both IEEE and ITU-T standard, XGS-PON, NG-PON2 and 10G-EPON
FEATURES
- High input sensitivity and Low Noise
- High-speed AGC response
APPLICATIONS
- IEEE and ITU-T standard, 10G-EPON/XGS-PON/NG-PON2